
DSB75 Development Support Board Rev. B1 Hardware Description
Strictly confidential / Released
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DSB75_hd_v08 Page 22 of 94 29.09.2005
Table 3: Pin assignment of B2B connector X100
Pin no. Signal name Signal name Pin no.
80 GND GND 1
79 DAC_OUT ADC1_IN 2
78 PWR_IND ADC2_IN 3
77 TP_ENV GND 4
76 RXD2_GPIO9 TXD2_GPIO10 5
75 SPICS SD_WP(GPIO8) 6
74 SD_3(GPIO4) SPIDI 7
73 SD_2(GPIO3) SD_DET(GPIO7) 8
72 SD_1(GPIO2) SD_CMD(GPIO6) 9
71 SD_0(GPIO1) SD_CLK(GPIO5) 10
70 I2CDAT I2CCLK 11
69 USB_DP VUSB_IN 12
68 USB_DN USC5 13
67 VSENSE ISENSE 14
66 VMIC USC6 15
65 EPN2 CCCLK 16
64 EPP2 VSIM 17
63 EPP1 CCIO 18
62 EPN1 CCRST 19
61 MICN2 CCIN 20
60 MICP2 CCGND 21
59 MICP1 USC4 22
58 MICN1 USC3 23
57 AGND USC2 24
56 IGT USC1 25
55 EMERG_RST USC0 26
54 DCD0 BATTEMP 27
53 CTS1 SYNC 28
52 CTS0 RXD1 29
51 RTS1 RXD0 30
50 DTR0 TXD1 31
49 RTS0 TXD0 32
48 DSR0 VDDLP 33
47 RING0 VCHARGE 34
46 VEXT CHARGEGATE 35
45 BATT+ GND 36
44 BATT+ GND 37
43 BATT+ GND 38
42 BATT+ GND 39
41 BATT+ GND 40
Note:
The electrical
characteristics of this
interface meet the
requirements of GSM
module’s application
interface.
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