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DSB75 Development Support Board Rev. B1 Hardware Description
Strictly confidential / Released
s
DSB75_hd_v08 Page 14 of 94 29.09.2005
2 General Overview
2.1 Key Features at a Glance
Table 1: Key features
Feature Implementation
GSM module interface
Direct connection and mechanical fixing of GSM module via 80-pin
board-to-board connector and screws.
Power supply
Laboratory PSU (9V…15V)
or
Battery 3.3V…4.5V
Battery charging
Implemented charging circuit (FET)
Operation with plug-in charging adapter
Antenna interface
Integrated connection between module’s Hirose connector and SMA
connector
SIM interface
SIM card connector with front tray loading and card detection
Supported SIM cards: 3V and 1.8V
SD Card interface
SD card connector with front slot, card detection indication and write
protection indication
Supply voltage: 2.9V
Supported modes:
SD mode or
SPI mode
Audio interfaces
Two analog audio interfaces (both with microphone supply) for
connecting a handset, headset or speakerphone.
One digital audio interface (DAI)
I²C interface
Host mode
Supports 3V or 5V devices (configurable)
Connected I²C EEPROM (128kBit) with adjustable addresses
SPI interface
(option)
Two interfaces to be used alternatively to other interfaces
Host mode
Serial interfaces
Three RS-232C interfaces:
COM1 - serial interface for data communication
COM2 - serial interface for control purposes
COM3 - serial interface for debug purposes
Max. baud rate: 460800 bps
Autobauding at TBD bps
USB interfaces
USB 1.1 Full Speed (12 Mbit/s) device interface at B receptacle
(default)
GPIOs
10 GPIOs at pins
Switchable pull-up/down resistors (for 8 GPIO’s)
LED signaling (for 8 GPIO’s)
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