Siemens XT75 Especificações Página 47

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XT65/XT75 Hardware Interface Overview
7.3 Board-to-Board Application Connector
s
XT65_XT75_HO_v00.130 Page 47 of 67 2006-10-12
Confidential / Preliminary
7.3 Board-to-Board Application Connector
This section provides the specifications of the 80-pin board-to-board connector used to connect XT65/XT75 to
the external application.
Connector mounted on the XT65/XT75 module:
Type: 52991-0808 SlimStack Receptacle 80 pins, 0.50mm pitch, for stacking heights from 3.0 to 4.0mm,
see Figure 14 for details.
Supplier: Molex, http//www.molex.com
Table 19: Technical specifications of Molex board-to-board connector
Parameter Specification (80-pin B2B connector)
Electrical
Number of Contacts 80
Contact spacing 0.5mm (.020")
Voltage 50V
Rated current 0.5A max per contact
Contact resistance 50m max per contact
Insulation resistance > 100M
Dielectric Withstanding Voltage 500V AC (for 1 minute)
Physical
Insulator material (housing) White glass-filled LCP plastic, flammability UL 94V 0
Contact material Plating: Gold over nickel
Insertion force 1
st
< 74.4N
Insertion force 30
th
< 65.6N
Withdrawal force 1
st
> 10.8N
Maximum connection cycles 30 (@ 70m max per contact)
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