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Siemens Building Technologies, Inc.
Figure 2. MBC components and key features.
Hardware
The MBC consists of the following 4 major
components:
• Enclosure Assembly - two sizes available to
house internal components.
• Power Module - supplies 24 Vdc and 24 Vac to
Point Termination Modules.
• Power Open Processor/Open Processor -
contains the main processor and
communications and is available with numerous
communications options. Select the appropriate
communications protocol from our list of over
150 systems and devices.
• Point Termination Modules - consist of an
electronic point module that performs A/D or
D/A conversion, signal processing, point
command output and communication with the
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